Power chips are attached to outside circuits through packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are normally packaged as power modules. Chip interconnection describes the electrical connection on the upper surface of the chip, which is normally light weight aluminum bonding cord in standard components. ^
Traditional power component bundle cross-section
Currently, commercial silicon carbide power modules still primarily utilize the packaging technology of this wire-bonded conventional silicon IGBT module. They deal with problems such as big high-frequency parasitical criteria, inadequate warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit using silicon carbide semiconductors. The display of superb performance. In order to address these problems and totally make use of the massive prospective benefits of silicon carbide chips, many brand-new product packaging modern technologies and remedies for silicon carbide power modules have actually emerged in the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold wires to copper cords, and the driving force is expense reduction; high-power gadgets have actually developed from aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product performance. The greater the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a strong copper bridge soldered to solder to connect chips and pins. Compared with standard bonding packaging approaches, Cu Clip innovation has the following advantages:
1. The connection in between the chip and the pins is made from copper sheets, which, to a specific extent, replaces the common cable bonding technique between the chip and the pins. For that reason, a special bundle resistance value, greater present flow, and far better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can totally save the expense of silver plating and poor silver plating.
3. The product look is completely constant with normal items and is generally used in servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and various other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding technique is much more expensive and complex, yet it can accomplish better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The source pad makes use of a Clip method, and the Gate makes use of a Wire method. This bonding approach is somewhat cheaper than the all-copper bonding approach, saving wafer area (relevant to very little gate areas). The procedure is simpler than the all-copper bonding method and can acquire better Rdson and far better thermal effect.
Distributor of Copper Strip
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