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Modified Sodium Silicate: A New Chapter in Silicates

Modified Sodium Silicate, abbreviated as MSS, is...

How to improve the high-frequency performance of Diode Thyristor?

As power electronic equipment develops towards high...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to have high thermal conductivity to dissipate a large amount of heat...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to...

Modified Sodium Silicate: A New Chapter in Silicates

Modified Sodium Silicate, abbreviated as MSS, is a specially treated sodium silicate. It has a series of unique physical and chemical properties by changing the composition and proportion of sodium silicate and adding...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to have high...
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Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to...

Modified Sodium Silicate: A New Chapter in Silicates

Modified Sodium Silicate, abbreviated as MSS, is a specially treated sodium silicate. It has a series of unique physical and chemical properties by changing the composition and proportion of sodium silicate and adding...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to have high thermal conductivity to dissipate a large amount of heat brought by power consumption, high-speed IC, and high-density packaging. Fillers such as silica have been mixed with polymers to improve their performance. Aluminum nitride (AlN) is considered a substitute due to its higher theoretical thermal conductivity of~320W/mK1, compatibility with silicon chips for CTE, and low dielectric constant. The sharp shape of AlN fillers used in commercial applications is mainly due to the direct grinding of...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices...

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Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices to reduce device propagation delay, but also needs to...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric...

Modified Sodium Silicate: A New Chapter in Silicates

Modified Sodium Silicate, abbreviated as MSS, is a specially...

How to improve the high-frequency performance of Diode Thyristor?

As power electronic equipment develops towards high frequencies, improving...

Revolutionary thermal conductive plastic packaging: breakthrough application of spherical aluminum nitride fillers

The encapsulation adhesive not only needs to have a suitable coefficient of thermal expansion (CTE) and a low dielectric constant compatible with IC devices...

Modified Sodium Silicate: A New Chapter in Silicates

Modified Sodium Silicate, abbreviated as MSS, is a specially treated sodium silicate. It has a series of unique physical and chemical properties by changing...

How to improve the high-frequency performance of Diode Thyristor?

As power electronic equipment develops towards high frequencies, improving the high-frequency performance of Diode Thyristor has become a vital issue. Diode Thyristor is a...

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